Trade fair highlight 29. September 2021
We create a pefect connection BIZON Push in Technology made by ZETKA
A PRESS-FIT ZONE WITH PARTICULAR FLEXIBILITY
We can give you broad-ranging design flexibility in terms of material selection, material thickness, material strength and adaptability to your specific needs and technical requirements. Made to measure exactly to the customer's needs.
Providing BIZON® press-fit technology, ZETKA offers an innovative solderless contacting system for all requirements in the automotive supply industry, electrical engineering, power electronics and any other application where secure contact connection to a printed circuit board or metal plate defines the quality of the final product.
Benefits
- Reliability more secure and longer-lasting than a conventional solder joint
- Space-saving in application with optimum use of package space (design to cost)
- Cost edge in processing and purchasing
- Simplification in processing as no need for complex process steps
- Process reliability thanks to the monitored BIZON® contact production process
- Material compatibility: compliance with automotive specifications (e.g. IMDS, CAMDS, RoHS, Reach)
- Mixed assembly on a printed circuit board – through variable tip height
- No collapsing – a major drawback of the needle-eye pin has been eliminated
- High plastic deformability – low spread of press-in force
- Maximum elasticity – double spring length, utilisation of PCB relaxation, short printed circuit board overhang
- Compliant with standards meets the requirements of DIN EN IEC 60352-5, IPC 9797
- BIZON® technology benefits from 40 years of experience in connecting systems and standardisation expertise
We can give you broad-ranging design flexibility in terms of material selection, material thickness, material strength and adaptability to your specific needs and technical requirements. Made to measure exactly to the customer's needs.
Providing BIZON® press-fit technology, ZETKA offers an innovative solderless contacting system for all requirements in the automotive supply industry, electrical engineering, power electronics and any other application where secure contact connection to a printed circuit board or metal plate defines the quality of the final product.
Benefits
- Reliability more secure and longer-lasting than a conventional solder joint
- Space-saving in application with optimum use of package space (design to cost)
- Cost edge in processing and purchasing
- Simplification in processing as no need for complex process steps
- Process reliability thanks to the monitored BIZON® contact production process
- Material compatibility: compliance with automotive specifications (e.g. IMDS, CAMDS, RoHS, Reach)
- Mixed assembly on a printed circuit board – through variable tip height
- No collapsing – a major drawback of the needle-eye pin has been eliminated
- High plastic deformability – low spread of press-in force
- Maximum elasticity – double spring length, utilisation of PCB relaxation, short printed circuit board overhang
- Compliant with standards meets the requirements of DIN EN IEC 60352-5, IPC 9797
- BIZON® technology benefits from 40 years of experience in connecting systems and standardisation expertise
ZETKA Stanz- und Biegetechnik
AG & Co. KG
Contact
Mr. Richard Riexinger